About eucleveladhesives

Basic Information

Date of Birth
February 19, 1993 (31)
About eucleveladhesives
Biography:
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. https://www.epoxyadhesiveglue.com/product/epoxy-underfill-chip-level-adhesives/
Location:
Huizhou City, Guangdong，China
Gender:
Male
Sub Voted:
N/A

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Last Activity
12-05-2022 12:32 AM
Join Date
12-05-2022
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