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  1. This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
    Huizhou City, Guangdong,China
    Website:
    https://www.deepmaterialcn.com/low-t...rotection.html
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About owtemperaturecuring

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Date of Birth
September 28, 1981 (42)
About owtemperaturecuring
Biography:
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
Huizhou City, Guangdong,China
Location:
China
Gender:
Male
Sub Voted:
N/A

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